Electronics and Packaging

Advanced packaging and electronics encompasses a wide variety of architectures and process technologies, enabling a modular approach to integrating more semiconductor devices with ever greater IO density. It has become essential for various modern microelectronic applications, including AI and High-Performance Computing servers that require raw compute power with integrated high bandwidth memory and mobile devices that demand specific size, weight, and power requirements. Advanced Packaging is a key innovation, often referred to as “More than Moore’s Law,” helping to keep the industry on the trajectory predicted by Moore’s Law. Download our Process Technologies in Advanced Packaging Handbook for more information.